Paper Number
AM6
Session
Additive Manufacturing and Composites
Title
Application of the sequence of physical processes (SPP) framework to the yielding and recovery of conductive pastes for screen printing
Presentation Date and Time
October 23, 2019 (Wednesday) 1:30
Track / Room
Track 1 / Room 305A
Authors
- Donley, Gavin J. (University of Illinois at Urbana-Champaign, Department of Chemical and Biomolecular Engineering)
- Hyde, William W. (DuPont, Experimental Station)
- Rogers, Simon A. (University of Illinois at Urbana-Champaign, Department of Chemical and Biomolecular Engineering)
- Nettesheim, Florian (DuPont, Nutrition and Biosciences)
Author and Affiliation Lines
Gavin J. Donley1, William W. Hyde2, Simon A. Rogers1, and Florian Nettesheim3
1Department of Chemical and Biomolecular Engineering, University of Illinois at Urbana-Champaign, Urbana, IL 61801; 2Experimental Station, DuPont, Wilmington, DE 19830; 3Nutrition and Biosciences, DuPont, Brabrand DK-8220, Denmark
Speaker / Presenter
Donley, Gavin J.
Text of Abstract
We utilize the recently developed “Sequence of Physical Processes” approach to investigate the yielding and recovery dynamics of two silver pastes that exhibit complex rheology. The SPP framework is unique as it allows insights to be gained regarding yielding and recovery processes on time scales significantly faster than the period of oscillation, with the temporal resolution limited only by the data acquisition time. This resolution allows for the accurate determination of yielding of soft materials under any predetermined pre-shear history, and at time scales that are relevant to the applications of these materials. The SPP approach enables us to resolve rapid material transitions which are inaccessible by steady-state techniques, along with their relative rates and timescales. These results are an important step towards a more comprehensive understanding of the complex behavior of yielding materials used in a variety of applications.