Paper Number
AM8 Keynote My Program
Session
Additive and Advanced Manufacturing
Title
Addressing process challenges in direct chip attachment process
Presentation Date and Time
October 21, 2025 (Tuesday) 4:25
Track / Room
Track 5 / O’Keeffe + Milagro
Authors
- Tjiptowidjojo, Kristianto (Avery Dennison, Engineering Technology)
- Mitha, Tanzeela (Avery Dennison, Engineering Technology)
- Fermin, Robert J. (Avery Dennison, Engineering Technology)
- Torres, Julia (Avery Dennison, Engineering Technology)
- Croslin, Bradley T. (Avery Dennison, Engineering Technology)
- Mehrabi, Ali R. (Avery Dennison, Engineering Technology)
Author and Affiliation Lines
Kristianto Tjiptowidjojo, Tanzeela Mitha, Robert J. Fermin, Julia Torres, Bradley T. Croslin and Ali R. Mehrabi
Engineering Technology, Avery Dennison, Azusa, CA
Speaker / Presenter
Tjiptowidjojo, Kristianto
Keywords
experimental methods; computational methods; advanced manufacturing; suspensions
Text of Abstract
Direct chip attachment (DCA) is a semiconductor packaging process of connecting a microchip directly to a circuit board. One avenue to accomplish it is by jetting uncured anisotropic conductive adhesive onto designated connection spots on the board followed by depositing the microchips on top of the adhesive. The chips-adhesive-board assembly are then undergoing press and cure step in order to solidify the adhesive, hence cement the connection between the chips conductive pads and the board mechanically and electrically. Optimizing the process requires full understanding of all of the steps involved. In this paper, we are presenting studies in two steps of the process: Adhesive jetting and chips deposition. In adhesive jetting step, we are studying how nozzle geometry, adhesive rheology, and jetting rates can be tuned to deliver optimum drop volume consistently in prescribed locations. In microchips deposition step, we are studying sensitivity of adhesive spread and fill dynamics as function of deposition speed, alignment, and adhesive rheology. We will then present gaps in knowledge and technology needed in order to speed up the process.